As 2025 concludes, the Win Mini 2025 deserves particular attention: it represents the third generation of GPD’s clamshell design and, thanks to its AMD Ryzen™ AI 9 HX 370 processor, stands as the most powerful clamshell-format handheld computer available. This year’s refresh represents not merely a cosmetic update, but a thoughtfully engineered evolution addressing the practical limitations of its predecessor.
Despite visual similarities to the 2024 model, the engineering differences run considerably deeper than initial appearances suggest:
- Enhanced Processing Power: The new AMD Ryzen AI 9 HX 370 APU delivers significant improvements in performance, featuring 12 cores, 24 threads, and a boost clock of 5.1 GHz.
- Comprehensive Thermal Redesign: The cooling system has been completely overhauled to accommodate the new APU’s thermal demands (28–35W TDP).
- Standardized Storage Format: The 2025 model adopts standard M.2 2280 SSDs (replacing the 2230 form factor), dramatically expanding available upgrade options.
- Ergonomic Material Refinement: The rear chassis now features a matte plastic finish that is more pleasant to the touch and reduces glare and fingerprinting compared to glossy surfaces.
- Improved Input Ergonomics: The joystick mode toggle switch has been repositioned for more convenient access.
Notably, relatively few internal components are carried over from the previous generation, underscoring the depth of this redesign rather than a typical point revision.
Technical Specifications
| Specification | Value |
|---|---|
| Processor Options | AMD Ryzen AI 9 HX 370 |
| CPU Cores / Threads | 12 / 24 (HX 370) |
| Base / Max Boost Clock | 2.0 GHz / 5.1 GHz |
| Manufacturing Process | TSMC 4nm (Strix Point architecture) |
| Cache | 36.75 MB |
| Memory | 64GB LPDDR5x-7500 MT/s (configurable to 8000 MT/s) |
| AI Performance (NPU) | 50 TOPS |
| Total Computing Power | 80 TOPS (CPU + GPU + NPU) |
| TDP (Configurable) | 28–35W |
The USB4 port enables connection to external GPU docks (such as the GPD G1), effectively converting the Win Mini into a desktop machine when docked.
The Ryzen AI 9 HX 370 represents a significant architectural advancement. Unlike previous-generation processors that treated the NPU as an ancillary accelerator, Zen 5’s XDNA 2 NPU is fully integrated into the compute fabric, enabling on-device inference of quantized models like GPT OSS 20B without cloud dependencies.
The 64GB configuration, with LPDDR5x memory at 7500 MT/s (configurable to 8000 MT/s), enables practical local inference of mid-tier language models like Qwen 3 Next 80B and PrimeIntellect-3 106B with acceptable latencies.
Detailed performance test results for the GPD Win Mini 2025, including comparative analysis against the previous generation and contemporary handheld devices, are available in the comprehensive benchmarking study linked below:
Benchmarking UMPCs of the second epoch.
Conclusion
Handheld computing enthusiasts rightfully prioritize portability — it’s the defining characteristic that distinguishes these devices from traditional computers. Any form factor expansion carries inherent risk.
The Win Mini 2025’s slight increase in size is offset by substantive engineering gains. The new Ryzen AI 9 HX 370 delivers strong multi-core improvements, while the thermal redesign maintains safe temperatures and reasonable acoustics. Standard M.2 2280 storage now enables practical upgradeability with hundreds of available options. These improvements address real limitations of the previous generation—genuine friction points that affected daily usability.
